Adhesive of epoxy resin of cold curing heat-resisting (4)

The heat-resisting adhesive of cold curing makes one of significant progress way of annulus oxygen adhesive, its method besides a few kinds commonly used, still have " other " . Colophony of other type hear resistance is added in annulus oxygen adhesive, like phenolic aldehyde colophony, get together sulphone also can increase hear resistance. Still can add to the middle of annulus oxygen matrix get together acyl inferior amine or acyl inferior amine compound, or use its as solidify agent, in order to raise the thermal stability of epoxy resin and anti-flammability. The Ma Lai acyl that if the person such as Chuan-Shaowu uses 3 phenyl,phosphine and armour second ketone make activator and dissolvent make take hydroxyl inferior oxygen radical has amine and link simple addition reaction, get each other wears network structure.
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4, other type epoxy resin

The synthesis such as Pang Jinxing goes out with epoxy resin of modified of colophony of baric phenolic aldehyde, fourth nitrile - 40, polyvinyl alcohol shrinks the constituent is armour such as fourth aldehyde, compound and multivariate the new-style adhesive that amine solidify agent is second constituent, in normal temperature, contact pressure falls can solidify, have taller stick receive intensity and heat-resisting performance, wait at spare parts of material of heat resistant material, attrition, metal, multi-layer packaging material applicably stick receive. The adhesive of HT2160 annulus oxygen of the development such as Liu Peng introduces phenolic aldehyde epoxy resin and fat link a group of things with common features epoxy resin answer match, be made up for main body with system of solidify of phenolic aldehyde amine and become, this kind of product is 16.4MPa in the shear strength after 24h of the solidify below room temperature, can work for a long time below 160 ℃ .

SasidharanAchary choose what carboxyl seals end to get together third 2 acerbity ester are opposite 2 mellow oneself epoxy resin undertakes modified, and with 2, 4, 6- 3 (2 armour are amino and methylic) phenol regards solidify as the agent, synthesis gives the annulus oxygen adhesive of cold curing, its use temperature to be able to amount to 120 ℃ . Hoffman uses epoxy resin of acrylic ester modified through dispersive and aggregate means, the adhesive that makes can issue solidify in room temperature, have below high temperature higher shear strength and come off intensity. Glue of the EP-33 of MasterBond company cold curing, working temperature is - 232 ℃ of 55 ～ . Can use at sticking to receive metal, glass, pottery and porcelain, lumber, plastic etc. Devcon company produces contain ferrule oxygen colophony to repair glue to be able to issue solidify in room temperature, short-term heat-resisting can amount to 300 ℃ , but because cost is higher and restricted its to use range.
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